Minimum soldering temperature is the minimum temperature necessary to ensure metallurgical bonding of the solder alloy and the base metals to be soldered. This standard is for managers, design and process engineers and technicians who deal with mass soldering processes.īackground During mass soldering, it is important that all solder joints reach the minimum soldering temperature. Purpose The purpose of this standard is to provide useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. time plot for each fully populated printed wiring board assembly (PWBA), using thermocouples attached with high-temperature solder or copper or aluminum tapes to selected representative components of the PWBA as it travels at a given belt speed (i.e., transport speed) through various temperature zones of an oven or soldering system. Thermal profile is a unique temperature vs. This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering. IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. This IPC-7530A revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. This IPC-7530A standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies.

Solder reflow profile